Advanced Packaging Machines for the Consumer Electronics Industry

Consumer electronics like white goods are an indispensable part of today’s household. The electronical devices in these products are moving from analog to a digital approach, which makes the inner components even more complex. PacTech offers suitable equipment for a big variety of applications used in this industry, for example:

  • Flip Chip (FC)
  • Wafer Level Chip Scale Packaging (WLCSP)
  • Single Chip (SC)

PacTech’s products allow for a high degree of precision and performance in advanced packaging applications. Take a look at our equipment for consumer electronics below to learn more about our products and how you can benefit your business.

Get in Contact with Sales
Advanced Packaging for White Goods Sector

Equipment for the Consumer Electronics Industry

2023-01-27T11:13:27+01:00

SB² – SMs Quantum

SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.

2023-10-25T10:01:35+02:00

PacLine

The PacLine 300 A50 is a fully automated machine for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.

2023-01-27T10:42:20+01:00

SB² – WB

SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.

2023-03-17T09:32:42+01:00

SB² – SM

The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

2023-10-25T10:01:27+02:00

Ultra – SB²

Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.

2023-05-31T10:33:30+02:00

SB² – USP

Highly flexible laser soldering and assembly platform for SMT components, especially for high-volume production in the automotive industry.

2023-02-07T10:00:35+01:00

SB² – Jet

SB²-Jet is the machine with the highest placement precision and smallest solder ball capability.

2023-01-27T11:04:22+01:00

SB² – Compact

SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

2024-05-07T12:16:08+02:00

LaPlace – VC

The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in wafer packs.

2024-01-08T10:38:16+01:00

LaPlace – FC

The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.