INTEGRATED FLIP CHIP ASSEMBLY MACHINE
LaPlace – FC
The LAPLACE-system provides an integrated solution for flip chip assembly. The laser assisted assembly is applied for soldering, ACF and NCP interconnections. The optional dispensing unit in the flip chip assembly platform allows a maximal flexibility for flux, solder paste and/or ACF, NCP dispense.
Highlights
- Flip chip placement, reflow & curing in one step
- Fluxfree reflow with laser
- No additional reflow or curing
- Suitable for Flip Chip Soldering and adhesive Flip Chip: ACF, NCP, ICA
Substrate materials:
– PI, PVC, PE, Polyester
– Paper based low cost substrates and others
Options
- Wafer Handling Systems
- Reel to Reel Unit
- Dispenser System
Benefits
- In-Line Capability
- High Throughput
- Available with different accuracy specs: ±25µm (standard), ±5µm, ±10µm (optional)
- Vision System
- Temperature Control Unit
- Laser Class 1
LaPlace – FC Products & Applications
Products
- Passive Components
- Sensors
- MEMS
- Smart Cards
- Smart Label Products
- LCD Drivers
Applications
- Flip Chip Assembly
- Flex to Flex Bonding
- Flip Chip Rework
