PacTech uses an electroless nickel plating process to deposit the Under-Bump-Metallurgy (UBM) and three different technologies to deposit / rework the solder spheres:

  • Single Sphere Laser Jetting using the SB² technology
  • Solder Sphere Transfer using the Ultra-SB² technology
  • Solder Ball Rework (Deballing and Reballing)

The choice between these solder deposition technologies is based on product type, bump height requirements, pad pitch, and volumes to be bumped.

Flip Chip Bumping and WLCSP Bumping Overview:

Wafer bumping is often separated into two different categories: flip chip bumping (FC) and wafer level chip scale packaging (WLCSP). This categorization and affiliated nomenclature is partially based on the solder bump size and the type of equipment used to create the bump.

“Flip Chip” refers to bumps on semiconductor wafers which are in the range of 50 to 200 µm in height and are usually assembled using and underfill material between the die and the substrate.

“WLCSP” refers to bumps that are in the range of 200 to 500 µm in height and are usually assembled without an underfill material.

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Solder Ball Mounting



Electroplating, or electrochemical deposition, is the process of using electrodeposition to coat an object in a layer of metal(s) on any substrate. RDL and Copper for example, are part of this process.

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Low-cost mask-less chemical deposition of various metal stacks on wafer surface to serve as intermetallic connection or to enhance product reliability and performance.

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Laser Assisted Bonding

Laser assisted bonding is an interconnection method performed through the laser energy to bond two surfaces of materials together.

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Solder Balling

Various solder deposition technologies to form solder bump for WLCSP and flip chip interconnects.

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Wafer Level Component Assembly

Wafer level assembly by attaching of dies or various passive components on wafer surface.

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Wafer Thinning

Thinning of wafer backside for dies in final packaging.

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Wafer Metal Coating

Application of various metal stacks via evaporation or sputtering technologies on wafer backside for better die performance.

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Wafer Dicing

High precision and accurate singulation of dies on a wafer.

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