LASER ASSISTED BONDING MACHINE – LAPLACE ®
Using localized laser heating mechanism, temperature can be applied selectively in the interconnection areas of interest without heating up the entire substrate up to the reflow temperature to liquefy and reflow an interconnection of a few microns. With customized bond tool and laser technology, pick-and-place and assembly reflow heating are accomplished in single step at high accuracy <5µm. Localized heat ensures reliable bonding of large dies while the in-situ reflow supports ultra-small die assembly as small as 300µm.
Our unique temperature control mechanism protects single chip or component from being over-heated and prevents substrate from warpage and repeating reflow circumstances.
Highlights
LAPLACE ® – Equipment
LAPLACE ® – FC
The LAPLACE ® - FC provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.
LAPLACE ® – Can
Ultra-fine-pitch cantilever assembly and laser bonding for wafer probe cards with optional rework capability.
LAPLACE ® – VC
The LAPLACE ® - VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in wafer packs.
LAPLACE ® – HT
The LAPLACE ® - HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.
LAPLACE ® – CPT
Laser Bonding System (LAB) with compression bonding and laser assisted reflow.
LAPLACE ® – LAR 600A
The LAPLACE ® LAR 600A revolutionizes reflow soldering with laser-assisted technology, offering faster reflow times, reduced thermal stress, and improved efficiency for a wide range of applications, while minimizing energy use and CO₂ emissions.
