AUTOMATIC LASER SOLDERING ASSEMBLY MACHINE
LaPlace – Can
Our solution for ultra-fine-pitch cantilever assembly and laser bonding for wafer probe cards with optional rework capability.
This platform is also suited for the vertical attachment of chips or similar devices loaded into the machine from feeding station to various carrier substrates loaded manually onto the machine’s work stage. The system uses a unique patented laser thermode tool, which is integrated in the vacuum pick and place unit of the bonder. For the high flexibility of the laser thermode, the system requires only a thin layer of solder on the substrate.
- Placement accuracy: ≤ +/- 5µm
- Probe card sizes up to 13 inch
- Full process control
- Alignment control by position bonding
- Height control accuracy: ≤ 5µm
- Cantilever thickness: 20 – 100µm
- Pitch: down to 60µm
LaPlace – Can Products & Applications
- Flash Memory
- Vertical Chip Bonding
- Cantilever Assembly
- Wafer Probe Cards