Probe Card Machines for Semiconductor Chips and Modules
Probe card is one of the most important key component to produce highly reliable semiconductor chips and modules. It acts as an interface between a tester and these semiconductor devices to let the tester to give a series of electrical signals for testing.
Currently, more attention is being paid to MEMS-type probe technology to meet the trend toward higher density.
PacTech offers you to an automated MEMS cantilever probe assembly solution:
- High precision solder deposition with solder balls
- Automated laser assisted bonder with high presision for MEMS cantilever assembly
Probe Card Equipment
LaPlace – Can
Ultra-Fine-Pitch Cantilever Assembly and Laser Bonding for Wafer Probe Cards with optional Rework Capability.