Advanced Packaging Machines for the Medical Industry
In the medical industry, it is important that any electronic components function reliably and properly. For ideal processing in the field of advanced packaging of, for example, endoscopes and pacemakers, PacTech offers suitable equipment for applications such as:
PacTech’s products allow for a high degree of precision and performance in advanced packaging applications. Take a look at our equipment for medical applications below to learn more about our products and how you can benefit your business.
Equipment for the Medical Industry
LAPLACE ® – FC
The LAPLACE ® - FC provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.
SB² ® – Jet
SB² ® - Jet is the machine with the highest placement precision and smallest solder ball capability.
SB² ® – SMs Quantum
SB² ® - SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.
SB² ® – WB
SB² ® - WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.
SB² ® – USP
Highly flexible laser soldering and assembly platform for SMT components, especially for high-volume production in the automotive industry.
PACLINE ®
The PACLINE ® 300 A50 is a fully automated machine for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.
LAPLACE ® – VC
The LAPLACE ® - VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in wafer packs.
SB² ® – Compact
SB² ® – Compact machine is the SB² ® entry point for high volume production with highly flexible and ultra-compact workstation.
SB² ® – SM
The SB² ® - SM is a machine for prototyping and small volume production that has wider working area than the SB² ® - M and more optional features.
Ultra-SB² ®
Ultra-SB² ® is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.
