SB² – Compact

The SB²-Compact is the newest addition to our industry-leading SB² laser soldering equipment family. It combines the advantages of our revolutionary SB² laser soldering technology with a highly flexible, ultra-compact workstation perfectly suited for economic budgets and lowest cost of ownership.

The SB²-Compact represents the entry point for high-volume automated sequential laser soldering, catering to a variety of different microelectronic devices, especially dedicated for camera modules, sensors, and optical devices. It can be flexibly integrated into any manufacturing line by utilizing different selectable customized handling systems, such as a single-drawer system, an inline-conveyor-system or an automatic cassette loading system. It’s plug-and-play design allows future upgrades of the customized handling system in the field. The system is capable to singulate, to position and to reflow solder balls with a diameter between 150 µm and 1,000 µm with a soldering speed of 6-8 balls per second. It’s available in different color-ways at customer’s choice.


  • Soldering mode: Jet mode
  • Available solder ball diameter: 150 – 1,000μm
  • Recommended soldering condition: 2D/3D soldering
  • Suitable for component/module soldering
  • Standard hardware/software interface for implementation in existing production line
  • Flexible machine configuration
  • Available in various colors
  • Optional auto alignment
  • Flexible integration into any manufacturing line
  • Lower investment
  • Plug-and-Play setup allowing easy upgrade in the field

SB² – Compact Products & Applications


  • Camera Modules
  • Finger Print Sensors
  • Facial Recognition
  • MEMS & 3D Package
  • Hard Disk Drive (HDD)
  • CMOS Sensors
  • Opto-Electronics
  • Microoptics
  • Filter Devices

    (SAW, BAW, F-BAR)


  • Chip Scale Packaging
  • Flip Chip
  • Single Chip
  • Ball Grid Array (BGA)
  • Printed Circuit Board (PCB)
  • Repair/Rework
  • Cu Coil Soldering
  • 3D Joint for Optoelectronic

SB² – Product Chart