Many dies are not designed for flip chip or wafer level chip scale packaging. The bond pads of many dies are designed as a peripheral row near the edge of the die. These bond pads are typically designed for wirebonding applications and are therefore often too small for solder bumping. Reconfiguring or redistributing these pads from the perimeter footprint to alternative locations on the chip enables wafer bumping (flip chip or WLCSP).

The use of redistribution layer allows utilization of greater area of the chip resulting in significant area savings, common I/O footprints, and enables the use of simpler, less expensive substrates. The first process step for redistribution is the deposition of a dielectric layer on the wafer to enhance the die passivation followed by metals trace to reroute the pads to new locations.

Download WLP Brochure
Get in Contact with Sales
RDL Redistribution Layer



Electroplating, or electrochemical deposition, is the process of using electrodeposition to coat an object in a layer of metal(s) on any substrate. RDL and Copper for example, are part of this process.

Go to Electroplating Service


Low-cost mask-less chemical deposition of various metal stacks on wafer surface to serve as intermetallic connection or to enhance product reliability and performance.

Go to Electroless-Plating Service

Laser Assisted Bonding

Laser assisted bonding is an interconnection method performed through the laser energy to bond two surfaces of materials together.

Go to Laser Assisted Bonding Service

Solder Balling

Various solder deposition technologies to form solder bump for WLCSP and flip chip interconnects.

Go to Solder Balling Service

Wafer Level Component Assembly

Wafer level assembly by attaching of dies or various passive components on wafer surface.

Go to WL Component Assembly Service

Wafer Thinning

Thinning of wafer backside for dies in final packaging.

Go to Wafer Thinning Service

Wafer Metal Coating

Application of various metal stacks via evaporation or sputtering technologies on wafer backside for better die performance.

Go to Wafer Metal Coating Service

Wafer Dicing

High precision and accurate singulation of dies on a wafer.

Go to Wafer Dicing Service