PACTECH PUBLICATIONS
- Innovative laser assisted 3.5D and SB² WB assembly processes for next generation advanced packaging
- Versatile hermetically sealed sensor platform for high frequency applications
- Assembly and Repair of mini- and µ-LED display panels using innovative laser assisted bonding
- Lasergestützte Fügeprozesse als Schlüsseltechnologie der zukünftigen Aufbau- und Verbindungstechnik
- Laser-assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures
- A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding
- Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor plattform
Study of solder interconnect configurations & performance of vertical laser assisted assembled “3.5D” packages
A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs
- Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die ship packages
- Controlled Gold Nanoparticle Placement into Patterned Polydimethylsiloxane Thin Films via Directed Self-Assembly
- Vertical laser assisted bonding for advanced “3.5D” chip packaging
- SB²-WB: A new process solution for advanced wire-bonding
- Deposition of Al and Cu nanoparticles on Silicon Wafer using a Picosecond Nd: YAG Laser: An Experiment-based Parameter Optimization Guide
- Comparison of nano particle implantation with picosecond lasers by concerning different wavelengths from Aluminum and Copper on Silicon wafer substrate
- Progress in Wafer Level Bumping, Flip Chip Assembly and Electromigration Performance in Flip Chip Lead-Free Solder Connections with 30µm or 40µm Diameter
- Advanced Laser Bonding of Ultra Fine Pitch Cantilever Spring Pins for Assembly of Flash, DRAM and Logic Probe Cards
Advanced Technologies and Equipment for 3D-Packaging
- Micro Ball Bumping for Wafer Level & 3-Dimensional Applications using Solder Sphere Transfer and Solder Jetting
- Eless NiPd and NiPdAu OPM: A Low Cost, High Throughput Solution for Enhanced Gold and Copper Wire Bond Reliability
- Micro Ball Bumping Packaging For Wafer Level & 3-D Solder Sphere Transfer and Solder Jetting
- Methods of Micro Ball Bumping for Wafer Level & 3-Dimensional Application using Solder Sphere Transfer and Solder Jetting
- Wafer Level Bumping and Flip Chip Assembly with Solder Balls Down to 30µm
- Processing and Reliability Analysis of Flip-Chips with Solder Bumps Down to 30 µm Diameter
- WLCSP and FlipChip Production Bumping Using Electroless Ni/Au Plating and Wafer Level Solder Sphere Transfer Technologies
- Wafer Level Packaging of Compound Semiconductors
- Adapted Assembly Processes for Flip-Chip Technology With Solder Bumps of 50µm or 40µm Diameter
- Wafer-Level Solder Sphere Placement and its Implications
- Wafer-Level Solder Sphere Placement and its Implications
- Repair, Rework, and Reball Solder Ball
- WLCSP and Flipchip production using electroless Ni/Au plating and Wafer Level Solder Sphere Transfer Technologies
- Wafer Bumping im Fokus
Laser Based Assembly of Ultra FinePitch Bumped ICs for Chip-to-Chip Proximity Coupled application
- New Solder Bumping Technology and Adapted Assembly Processes for 100µm Pitch Flip-Chip-Technology Using Capillary Flow or No Flow Underfill
- Electroless Nickel/Gold Under-Bump-Metallization Cost Comparison
- Ultra Fine Pitch Bumping Using e-Ni/Au and Sn Lift-Off Processes
- WLCSP and Flip Chip Bumping Technologies
- WLCSP Solder Bumping Mechanical Reliability Testing
- WLCSP Production using electroless NiAu Plating and Wafer Level Solder Sphere transfer Technology
- Bumping for WLCSP using micro solder ball attach on electroless NiAu & NiPdAu UBM
- ENIG vs. ENEP (G) Under Bump Metallization for Lead free WL-CSPSolder Bumps – a Comparison of Intermetallic Properties Using High Speed Pull Test
- Solder Bumping-ein neues flexibles AVT-Verfahren für optoelektronische Systeme
- Wafer Level Packaging & Bumping – New achievements on technical feasibility and reliability by using an electroless Ni/Au UBM
- Wafer Level Packaging & Bumping – A view from a European Service Provider
- (Micro) Ball Placement for Wafer Level CSP
- Laser assisted Soldering and Flip Chip Attach for 3-D Packaging
- Wafer Bumping & Wafer Level Packaging for 300mm Wafer
- Wafer Bumping & Wafer Level Packaging for the European Market
- Pulsed-laser Heating for Flip Chip Assembly
- 300mm-Electroless Bumping
- Wafer Bumping – State of the art technology; Requirements & developments from the perspective of a European Wafer Bumping Service Provider
- 300mm-Electroless Bumping
- Low Cost Electroless Bumping for Ultra Fine Pitch Applications in 8″ and 12″ Wafers
- Lead-Free Solder Bumping for High Temperature Automotive Application
- LAPLACE – A New Assembly Method using Laser Heating for Ultra Fine Pitch Devices
- Process Makes Electroless Nickel/Gold Wafer Bumping Economical for Flip-Chip Packaging
- A New Low Stress and Flexible Assembly Method using Laser Heating for NCP, ACF and Solder Interconnection
- Fluxless Laser Solder Jetting for Optoelectronics and MEMS Packaging
- Laser Assisted Flip Chip Assembly for LCD Applications using ACP and NCP Adhesive Joining
- Advanced Flip Chip Technology and It´s Application in Europe
- Cost-Effective 300mm Electroless Wafer Bumping
- Laser Solder Jetting in Advanced Packaging
- Placement and reflow of solder balls for FC, BGA, Wafer-Level-CSP, Optoelectronic Components and MEMS by using a new solder jetting method
- Laser Solder Attach for Optoelectronics Packages
- IMAPS Flip Chip Technology Workshop 2002, Contactless Laser Solder Jetting for fine pitch flip chip bumps
- Laser Solder Ball Application for Optoelectronics and MEMS Packaging
- High Speed Laser Solder Jetting Technology for Optoelectronics and MEMS Packaging
- A Semi-Additive Electroless Ni-Au Process Offers a Low-Cost Wafer-Bumping Method
- Low Cost Flip Chip Bumping
- A Wafer Level CSP based on a Low Cost Electroless Redistribution Layer
- Single and Multiple Laser Solder Ball Placement and Reflow for Wafer Level CSP
- Wafer Level CSP using Low Cost Electroless Redistribution Layer
- Low Cost Bumping on Wafer Level for 300mm Wafer
- A Low Cost Bumping Process for 300mm Wafers
- A Bumping Process for 12″ Wafers