Innovative laser assisted 3.5D and SB² WB assembly processes for next generation advanced packaging

Versatile hermetically sealed sensor platform for high frequency applications

Assembly and Repair of mini- and µ-LED display panels using innovative laser assisted bonding

Lasergestützte Fügeprozesse als Schlüsseltechnologie der zukünftigen Aufbau- und Verbindungstechnik

Laser-assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures

A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding

Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor plattform

Study of solder interconnect configurations & performance of vertical laser assited assembled “3.5D” packages

A study on laser-assited bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs

Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die ship packages

Controlled Gold Nanoparticle Placement into Patterned Polydimethylsiloxane Thin Films via Directed Self-Assembly

Vertical laser assisted bonding for advanced “3.5D” chip packaging

SB²-WB: A new process solution for advanced wire-bonding

Deposition of Al and Cu nanoparticles on Silicon Wafer using a Picosecond Nd: YAG Laser: An Experiment-based Parameter Optimization Guide

Comparison of nano particle implantation with picosecond lasers by concerning different wavelengths from Aluminum and Copper on Silicon wafer substrate

Progress in Wafer Level Bumping, Flip Chip Assembly and Electromigration Performance in Flip Chip Lead-Free Solder Connections with 30µm or 40µm Diameter

Advanced Laser Bonding of Ultra Fine Pitch Cantilever Spring Pins for Assembly of Flash, DRAM and Logic Probe Cards

Advanced Technologies and Equipment for 3D-Packaging

Micro Ball Bumping for Wafer Level & 3-Dimensional Applications using Solder Sphere Transfer and Solder Jetting

Eless NiPd and NiPdAu OPM: A Low Cost, High Throughput Solution for Enhanced Gold and Copper Wire Bond Reliability

Micro Ball Bumping Packaging For Wafer Level & 3-D Solder Sphere Transfer and Solder Jetting

Methods of Micro Ball Bumping for Wafer Level & 3-Dimensional Application using Solder Sphere Transfer and Solder Jetting

Wafer Level Bumping and Flip Chip Assembly with Solder Balls Down to 30µm

Processing and Reliability Analysis of Flip-Chips with Solder Bumps Down to 30 µm Diameter

WLCSP and FlipChip Production Bumping Using Electroless Ni/Au Plating and Wafer Level Solder Sphere Transfer Technologies

Wafer Level Packaging of Compound Semiconductors

Adapted Assembly Processes for Flip-Chip Technology With Solder Bumps of 50µm or 40µm Diameter

Wafer-Level Solder Sphere Placement and its Implications

Wafer-Level Solder Sphere Placement and its Implications

Repair, Rework, and Reball Solder Ball

WLCSP and Flipchip production using electroless Ni/Au plating and Wafer Level Solder Sphere Transfer Technologies

Wafer Bumping im Fokus

Laser Based Assembly of Ultra FinePitch Bumped ICs for Chip-to-Chip Proximity Coupled application

New Solder Bumping Technology and Adapted Assembly Processes for 100µm Pitch Flip-Chip-Technology Using Capillary Flow or No Flow Underfill

Electroless Nickel/Gold Under-Bump-Metallization Cost Comparison

Ultra Fine Pitch Bumping Using e-Ni/Au and Sn Lift-Off Processes

WLCSP and Flip Chip Bumping Technologies

WLCSP Solder Bumping Mechanical Reliability Testing

WLCSP Production using electroless NiAu Plating and Wafer Level Solder Sphere transfer Technology

Bumping for WLCSP using micro solder ball attach on electroless NiAu & NiPdAu UBM

ENIG vs. ENEP (G) Under Bump Metallization for Lead free WL-CSPSolder Bumps – a Comparison of Intermetallic Properties Using High Speed Pull Test

Solder Bumping-ein neues flexibles AVT-Verfahren für optoelektronische Systeme

Wafer Level Packaging & Bumping – New achievements on technical feasibility and reliability by using an electroless Ni/Au UBM

Wafer Level Packaging & Bumping – A view from a European Service Provider

(Micro) Ball Placement for Wafer Level CSP

Laser assisted Soldering and Flip Chip Attach for 3-D Packaging

Wafer Bumping & Wafer Level Packaging for 300mm Wafer

Wafer Bumping & Wafer Level Packaging for the European Market

Pulsed-laser Heating for Flip Chip Assembly

300mm-Electroless Bumping

Wafer Bumping – State of the art technology; Requirements & developments from the perspective of a European Wafer Bumping Service Provider

300mm-Electroless Bumping

Low Cost Electroless Bumping for Ultra Fine Pitch Applications in 8″ and 12″ Wafers

Lead-Free Solder Bumping for High Temperature Automotive Application

LAPLACE – A New Assembly Method using Laser Heating for Ultra Fine Pitch Devices

Process Makes Electroless Nickel/Gold Wafer Bumping Economical for Flip-Chip Packaging

A New Low Stress and Flexible Assembly Method using Laser Heating for NCP, ACF and Solder Interconnection

Fluxless Laser Solder Jetting for Optoelectronics and MEMS Packaging

Laser Assisted Flip Chip Assembly for LCD Applications using ACP and NCP Adhesive Joining

Advanced Flip Chip Technology and It´s Application in Europe

Cost-Effective 300mm Electroless Wafer Bumping

Laser Solder Jetting in Advanced Packaging

Placement and reflow of solder balls for FC, BGA, Wafer-Level-CSP, Optoelectronic Components and MEMS by using a new solder jetting method

Laser Solder Attach for Optoelectronics Packages

IMAPS Flip Chip Technology Workshop 2002, Contactless Laser Solder Jetting for fine pitch flip chip bumps

Laser Solder Ball Application for Optoelectronics and MEMS Packaging

High Speed Laser Solder Jetting Technology for Optoelectronics and MEMS Packaging

A Semi-Additive Electroless Ni-Au Process Offers a Low-Cost Wafer-Bumping Method

Low Cost Flip Chip Bumping

A Wafer Level CSP based on a Low Cost Electroless Redistribution Layer

Single and Multiple Laser Solder Ball Placement and Reflow for Wafer Level CSP

Wafer Level CSP using Low Cost Electroless Redistribution Layer

Low Cost Bumping on Wafer Level for 300mm Wafer

A Low Cost Bumping Process for 300mm Wafers

A Bumping Process for 12″ Wafers