Publications by PacTech

MiNaPAD – Innovative Pressureless Wire-Bonding for High-Power Systems

iMAPS Italy – Overcoming Interconnect Challenges in Chiplet Architectures using Laser-Assisted Bonding

Selective Post-Soldering Volume Adjustment for Improved Co-Planarity of C4 Bump Interfaces

Chip Scale Review: Direct laser reflow techniques for stable and reliable solder bump interfaces on semiconductor substrates

A study about direct laser reflow for forming stable and reliable C4 bump interfaces on semiconductor substrates for Flip Chip applications

ISES – Innovative laser assisted bonding process for next generation advanced packaging

iMAPS – Laser assisted bonding as recommended soldering technology for next generation sensor packaging

IEMT – Innovative laser assisted bonding technologies for next generation advanced packaging

EPP – Advanced Laser Assisted Bonding Technologies for high-power device assembly

Exploring direct laser reflow techniques for forming stable and reliable solder bump interfaces on semiconductor substrates

Forming of advanced THT-interconnects using SB² ® laser solder jetting process

Next generation advanced packaging using innovative laser assisted bonding equipment

Innovative laser assisted 3.5 D ® and SB² ® WB assembly processes for next generation advanced packaging

Versatile hermetically sealed sensor platform for high frequency applications

Laser-assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures

A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding

Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor platform

Study of solder interconnect configurations & performance of vertical laser assisted assembled “3.5 D ®” packages

A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs

Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages