PacTech offers subcontractor electroless nickel plating services for wafer bumping, pad redistribution and ACF/ACA applications. PacTech has three manufacturing sites around the world which offer these services. Our goal is to be customer oriented and flexible to meet all the customer’s needs. We offer support for prototyping, engineering, and R&D projects as well as high volume production. Each PacTech facility has a throughput of 600,000 wafers per year.
PacTech offers several different pad finshes and layer thicknesses using electroless nickel plating in combination with electroless palladium and immersion gold process: