Advanced Packaging Machines for the Aerospace Industry

In the aerospace industry, it is important that any electronic components function reliably and properly. For ideal processing in the field of advanced packaging of, for example, optical electronics and spectroscopes, PacTech offers suitable equipment for applications such as:

  • Flip Chip (FC)
  • Wafer Level Chip Scale Packaging (WLCSP)

  • Single Chip (SC)

PacTech’s products allow for a high degree of precision and performance in advanced packaging applications. Take a look at our equipment below for the aerospace industry to learn more about our products and how you can benefit your business.

Advanced Packaging for Aerospace Sector

Equipment for the Aerospace Industry

2023-01-27T10:42:20+01:00

SB² – WB

SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.

2023-03-17T09:32:42+01:00

SB² – SM

The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

2023-01-27T11:13:27+01:00

SB² – SMs Quantum

SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.

2023-10-25T10:01:27+02:00

Ultra – SB²

Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.

2023-02-07T10:00:35+01:00

SB² – Jet

SB²-Jet is the machine with the highest placement precision and smallest solder ball capability.

2023-10-25T10:01:35+02:00

PacLine

The PacLine 300 A50 is a fully automated machine for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.

2023-01-27T11:04:22+01:00

SB² – Compact

SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

2023-05-31T10:33:30+02:00

SB² – USP

Highly flexible laser soldering and assembly platform for SMT components, especially for high-volume production in the automotive industry.

2023-01-27T10:40:47+01:00

LaPlace – VC

The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in waffle packs.

2024-01-08T10:38:16+01:00

LaPlace – FC

The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.