UNIVERSAL SOLDERING PLATFORM FOR HIGH-VOLUME LASER SOLDERING

SB² ® – USP

PacTech’s new SB² ® – USP machine solution expands the SB² ® product family of laser soldering systems to include a highly flexible and universal soldering platform for component assembly and laser soldering in the SMT sector, especially for high-volume production in the automotive industry.

This platform sets new standards in automation, application spectrum and production quality. The combination of several robots with a variety of PacTech’s unique process modules such as solder jetting, laser wire soldering, wire bonding, dispensing and laser reflow overcomes the process-related limitations of conventional soldering and joining systems. Take your demand for efficiency and multifunctionality to a new level.

Highlights

  • SMT component Assembly
  • Die- and Pin Soldering
  • Solder Jetting
  • Laser Reflow
  • Flux- and Solderpaste Dispense
Options

  • Pick & Place Scara Robot

  • 6 Axis Soldering Robot

  • Inline Conveyer

  • Solder Ball Size: 1-2mm

  • UPH: >1000 (2-Pin product)

SB² USP

SB² ® – USP Products & Applications

Products

  • LED
  • LIDAR
  • PDC
  • Endoscope
  • Pacemaker
  • White Goods
  • Connectors

  • Spectroscope

  • Optics

Applications

  • Chip & Component
    Assembly

  • Pin Soldering
Advanced Packaging for Production and Assembly Sector

SB² ® – Product Chart

SB2-Product-Chart