UNIVERSAL SOLDERING PLATFORM FOR HIGH-VOLUME LASER SOLDERING
SB² – USP
PacTech’s new SB²-USP machine solution expands the SB² product family of laser soldering systems to include a highly flexible and universal soldering platform for component assembly and laser soldering in the SMT sector, especially for high-volume production in the automotive industry.
This platform sets new standards in automation, application spectrum and production quality. The combination of several robots with a variety of PacTech’s unique process modules such as solder jetting, laser wire soldering, wire bonding, dispensing and laser reflow overcomes the process-related limitations of conventional soldering and joining systems. Take your demand for efficiency and multifunctionality to a new level.
Highlights
- SMT component Assembly
- Die- and Pin Soldering
- Solder Jetting
- Laser Reflow
- Flux- and Solderpaste Dispense
Pick & Place Scara Robot
6 Axis Soldering Robot
Inline Conveyer
Solder Ball Size: 1-2mm
UPH: >1000 (2-Pin product)

SB² – USP Products & Applications
Products
- LED
- LIDAR
- PDC
- Endoscope
- Pacemaker
- White Goods
- Connectors
Spectroscope
- Optics
Applications
Chip & Component
Assembly- Pin Soldering