Home2022-04-05T14:33:43+02:00

ADVANCED PACKAGING EQUIPMENT AND
WAFER LEVEL PACKAGING SERVICES

Advanced Packaging Equipment &
Wafer Level Packaging Services

PACTECH EQUIPMENT, WLP SERVICES & PRODUCTS

Equipment

Discover our revolutionary Advanced Packaging Equipment for automated and high precision manufacturing.

Chemical Products for Wafer Level Packaging

Services

Engage with us for highly customized Wafer Level Packaging services with our line-up of edge-leading capabilities installed.

Advanced Packaging Equipment

Chemicals

Our product portfolio includes concentrates and pre-mixed baths ready to be used. 

WAFER LEVEL PACKAGING SERVICES

Wafer Level Redistribution RDL

Redistribution Layer / RDL

Rerouting of pads on a wafer with metal and dielectric layers to fulfil the subsequent packaging rules.

Copper Pillar

Copper Pillar

Electroplated Cu pillar with optional Ni diffusion barrier and SnAg cap for low cost and fine-pitch flip chip interconnects.

Wafer Level UBM Electroless Plating

Electroless Plating

Low-cost mask-less chemical deposition of various metal stacks on wafer surface to serve as intermetallic connection or to enhance product reliability and performance.

Solder Bumping Balling

Solder Bumping

Various solder deposition technologies to form solder bump for WLCSP and flip chip interconnects.

Bonding and Assembly

Wafer Level Component Assembly

Wafer level assembly by attaching of dies or various passive components on wafer surface.

Wafer Thinning

Wafer Thinning

Thinning of wafer backside for dies in final packaging.

Wafer Backside Coating Metallization

Wafer Metal Coating

Application of various metal stacks via evaporation or sputtering technologies on wafer backside for better die performance.

Wafer Sawing Dicing

Wafer Dicing

High precision and accurate singulation of dies on a wafer.

What Our Customers Say

Pac Tech are most efficient in terms of delivering the batches well within the time limit and ensuring the highest standard of the process. I would highly recommend working with them.

M.-U. Hassan, IMS Chips, Germany

Pac Tech has very strong customer service and manufacturing teams making it easy for us to recommend them to our IDM partners. When they commit, they deliver.

K. J. Rebibis, Imec, Belgum

Let me compliment you for the quality and promply services we received from you. We were very happy with the results and will not hesitate to contact you again whatever needed.

M. Svensson, Acreo, Sweden
What we appreciated most about working with Pac Tech was their ability to guide us through the technical requirements of a projekt, keep everyone happy, and deliver the expected results.
P. Weldon, DELTA, Denmark

PACTECH EQUIPMENT PORTFOLIO

2022-03-10T16:14:04+01:00

Ultra-SB² 300

Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.

2022-03-10T16:19:02+01:00

SB²-WB

SB²-WB is a combination of PacTech’s unique solder ball jetting technology with a wire feeding mechanism to perform wiring process.

2022-03-10T16:21:43+01:00

SB²-SMs Quantum

SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.

2022-03-10T16:18:34+01:00

SB²-SM

The SB2-SM is the platform for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

2022-03-10T16:22:51+01:00

SB²-RSP

SB²-RSP system is a flexible robot soldering platform for automated angle-free laser soldering, especially for SMT components.

2022-03-10T16:18:01+01:00

SB²-M

SB2-M is an entry point for R&D with a small footprint and lower investment.

2022-03-10T16:22:14+01:00

SB²-Jet

SB²-Jet is the platform with the highest placement precision and smallest solder ball capability.

2022-03-10T16:19:31+01:00

SB²-Compact

SB²-Compact is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

2022-03-10T16:14:32+01:00

PacLine 300 A50

The PacLine 300 A50 is a fully automated equipment for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.

2022-03-10T16:11:46+01:00

LAPLACE-VC

The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in waffle packs.

2022-03-10T16:10:51+01:00

LAPLACE-HT

The LaPlace-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.

2022-03-10T16:12:53+01:00

LAPLACE-FC

The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.

2022-03-10T16:12:20+01:00

LAPLACE-Can

Ultra-Fine-Pitch Cantilever Assembly and Laser Bonding for Wafer Probe Cards with optional Rework Capability.

LATEST PACTECH NEWS

Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor plattform

by Kevin Kröhnert, Georg Friedrich, Dzmitry Starukhin, Markus Wöhrmann, Michael Schiffer, Martin Schneider-Ramelow. In this work we present aspects of our versatile hermetically sealed sensor platform. The sealed glass package can include passive and active devices (radar, pressure, infrared sensors). Glass is used due to its ideal properties for such applications, like excellent chemical resistance, mechanical strength and low costs. The hermetic sealing allows seamless operation in hazardous environments. The tgvs (Through – Glass - Vias) may [...]

April 25th, 2022|Categories: Publications|0 Comments

A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding

by Matthias Fettke, Timo Kubsch, Alexander Frick, Vinith Bejugam, Georg Friedrich, Thorsten Teutsch. This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC (Multilayer Ceramic Chip Capacitor) capacitors and presents a comparison to conventional bonding using solder paste and reflow oven. The LAB technique, unique to Pac Tech, has greatly improved ensuing properties of packages over conventional oven reflow processes. As the LAB process is temperature controlled, it allows for a non-destructive yet fast [...]

April 25th, 2022|Categories: Publications|0 Comments

Versatile Hermetically Sealed Sensor Platform for High Frequency Applications

by Kevin Kröhnert, Markus Wöhrmann, Michael Schiffer, Georg Friedrich, Dzmitry Starukhin, Martin Schneider-Ramelow, Winfried Mayer, Tobias Chaloun, Thomas Galler, Christian Waldschmidt, Malte Schulz-Ruhtenberg, Norbert Ambrosius, Ulli Hansen. In this work, we present the realized versatile hermetically sealed sensor packaging platform based on glass interposers which is applicable in industrial metrology, MEMS,photonics, life sciences and process automation application, among others. The sealed glass package can include passives and different active devices (radar, pressure, infrared sensors, etc.). Glass is [...]

April 8th, 2022|Categories: Publications|0 Comments
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