by Kevin Kröhnert, Markus Wöhrmann, Michael Schiffer, Georg Friedrich, Dzmitry Starukhin, Martin Schneider-Ramelow, Winfried Mayer, Tobias Chaloun, Thomas Galler, Christian Waldschmidt, Malte Schulz-Ruhtenberg, Norbert Ambrosius, Ulli Hansen. In this work, we present the realized versatile hermetically sealed sensor packaging platform based on glass interposers which is applicable in industrial metrology, MEMS,photonics, life sciences and process automation application, among others. The sealed glass package can include passives and different active devices (radar, pressure, infrared sensors, etc.). Glass is [...]

by Matthias Fettke, Timo Kubsch, Alexander Frick, Vinith Bejugam, Georg Friedrich, Thorsten Teutsch. This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC (Multilayer Ceramic Chip Capacitor) capacitors and presents a comparison to conventional bonding using solder paste and reflow oven. The LAB technique, unique to Pac Tech, has greatly improved ensuing properties of packages over conventional oven reflow processes. As the LAB process is temperature controlled, it allows for a non-destructive yet fast [...]

by Kevin Kröhnert, Georg Friedrich, Dzmitry Starukhin, Markus Wöhrmann, Michael Schiffer, Martin Schneider-Ramelow. In this work we present aspects of our versatile hermetically sealed sensor platform. The sealed glass package can include passive and active devices (radar, pressure, infrared sensors). Glass is used due to its ideal properties for such applications, like excellent chemical resistance, mechanical strength and low costs. The hermetic sealing allows seamless operation in hazardous environments. The tgvs (Through – Glass - Vias) may [...]