Publikationen von PacTech

A study about direct laser reflow for forming stable and reliable C4 bump interfaces on semiconductor substrates for Flip Chip applications

Innovative laser assisted bonding process for next generation advanced packaging

Laser assisted bonding as recommended soldering technology

Innovative laser assisted bonding technologies for next generation advanced packaging

Advanced Laser Assisted Bonding Technologies for high-power device assembly

Exploring direct laser reflow techniques for forming stable and reliable solder bump interfaces on semiconductor substrates

Forming of advanced THT-interconnects using SB² laser solder jetting process

Next generation advanced packaging using innovative laser assisted bonding equipment

Innovative laser assisted 3.5D and SB² WB assembly processes for next generation advanced packaging

Versatile hermetically sealed sensor platform for high frequency applications

Assembly and Repair of mini- and µ-LED display panels using innovative laser assisted bonding

Lasergestützte Fügeprozesse als Schlüsseltechnologie der zukünftigen Aufbau- und Verbindungstechnik

Laser-assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures

A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding

Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor platform

Study of solder interconnect configurations & performance of vertical laser assited assembled “3.5D” packages

A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs

Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages

Controlled Gold Nanoparticle Placement into Patterned Polydimethylsiloxane Thin Films via Directed Self-Assembly

Vertical laser assisted bonding for advanced “3.5D” chip packaging

SB²-WB: A new process solution for advanced wire-bonding