Publikationen von PacTech

MiNaPAD – Innovative Pressureless Wire-Bonding for High-Power Systems

iMAPS Italy – Overcoming Interconnect Challenges in Chiplet Architectures using Laser-Assisted Bonding

Selective Post-Soldering Volume Adjustment for Improved Co-Planarity of C4 Bump Interfaces

Chip Scale Review: Direct laser reflow techniques for stable and reliable solder bump interfaces on semiconductor substrates

A study about direct laser reflow for forming stable and reliable C4 bump interfaces on semiconductor substrates for Flip Chip applications

Innovative laser assisted bonding process for next generation advanced packaging

Laser assisted bonding as recommended soldering technology

Innovative laser assisted bonding technologies for next generation advanced packaging

Advanced Laser Assisted Bonding Technologies for high-power device assembly

Exploring direct laser reflow techniques for forming stable and reliable solder bump interfaces on semiconductor substrates

Forming of advanced THT-interconnects using SB² laser solder jetting process

Next generation advanced packaging using innovative laser assisted bonding equipment

Versatile hermetically sealed sensor platform for high frequency applications

Laser-assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures

A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding

Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor platform

Study of solder interconnect configurations & performance of vertical laser assited assembled “3.5D” packages

A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs

Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages