Wire Soldering Machines for Connecting IC’s, Devices and Chips

Wire bonding is a common method of connecting integrated circuits and packaged devices/chips with metal wires. We offer a slightly different wire bonding technique using solder, called ‘wire soldering’, which is slightly different from these common methods. Wire soldering is an alternative method of connecting pads and wires developed by PacTech. The advantages of this process include:

  • No mechanical stress on the chip
  • Wire shows more homogenous heat distribution with ampacity test
  • Lower neck-break risk
  • More flexible loop shape forming
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Wirebond pad

Wire Soldering Equipment


SB² – WB

SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.