Wire Soldering Machines for Connecting IC’s, Devices and Chips
Wire bonding is a common method of connecting integrated circuits and packaged devices/chips with metal wires. We offer a slightly different wire bonding technique using solder, called ‘wire soldering’, which is slightly different from these common methods. Wire soldering is an alternative method of connecting pads and wires developed by PacTech. The advantages of this process include:

Wire Soldering Equipment
Pia Bubelt2025-01-07T04:21:06+01:00
SB² ® – WB
SB² ® - WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.