PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services. Since our establishment, our team has been working relentlessly on developing new leading-edge technologies for the next generation applications. We are known to be highly adaptive to customization and unique applications. Our team of technical experts is striving to resolve various packaging challenges faced by the industry to provide our customers and partners more competitive solutions in terms of cost, time-to-market, and technology advancement. Our headquarter is located in Nauen, Germany with two operation and manufacturing sites in Santa Clara, CA, USA and Penang, Malaysia. Together with our sales and field service teams across the globe, we can cater to the demand within your region.

With our state-of-the-art wafer level bumping, metallization, and advanced packaging processes PacTech supports the heterogeneous integration technology roadmap. In combination with our unique laser soldering and laser bonding equipment, PacTech is able to offer a variety of manufacturing and engineering solutions for the technical and economic challenges in today’s industry.  Our manufacturing sites are ISO 9001 and IATF 16949 certified for highest level of quality and process control. Being a socially responsible company, we are also ISO 14001 and ISO 50001 certified for our operations.