INTRODUCTION VIDEO

Come and find out more about PacTech and our three business units: Advanced Packaging Equipment, Wafer Level Packaging and Chemicals in less than three minutes! 

PACTECH – PACKAGING TECHNOLOGIES – WHO ARE WE?

PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services. Since our establishment, our team has been working relentlessly on developing new leading-edge technologies for the next generation applications. We are known to be highly adaptive to customization and unique applications. Our team of technical experts is striving to resolve various packaging challenges faced by the industry to provide our customers and partners more competitive solutions in terms of cost, time-to-market, and technology advancement. Our headquarter is located in Nauen, Germany with two operation and manufacturing sites in Santa Clara, CA, USA and Penang, Malaysia. Together with our sales and field service teams across the globe, we can cater to the demand within your region.

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ADVANCED PACKAGING EQUIPMENT

Our advanced packaging equipment portfolio incorporates several core technologies including laser soldering and wire soldering, laser assisted bonding and innovative wafer level bumping solutions such as electroless plating and wafer level ball placement. We offer equipment solutions for high throughput and fully automated manufacturing as well as advanced research and development field work.

Advanced Packaging Equipment Circuit

WAFER LEVEL PACKAGING SERVICES

With our state-of-the-art wafer level bumping, metallization, and advanced packaging processes PacTech supports the heterogeneous integration technology roadmap. In combination with our unique laser soldering and laser bonding equipment, PacTech is able to offer a variety of manufacturing and engineering solutions for the technical and economic challenges in today’s industry.  Our manufacturing sites are ISO 9001 and IATF 16949 certified for highest level of quality and process control. Being a socially responsible company, we are also ISO 14001 and ISO 50001 certified for our operations.

Wafer Bumping

CHEMICALS

As a turnkey solution provider for electroless plating, we are supplying complete process solutions to our customers by combining our plating know-how, equipment and process chemicals to guarantee a successful process transfer. Our plating chemicals are controlled by highest quality standards and are available throughout a worldwide distribution network to handle import and warehousing task, but also to provide technical onsite support to our customers.

Chemicals for Wafer Level Packaging

PACTECH LOCATIONS

PacTech
Packaging Technologies GmbH

Am Schlangenhorst 7-9
14641 Nauen
Germany

PacTech USA Inc.

328 Martin Ave
Santa Clara
CA 95050
USA

PacTech Asia Sdn. Bhd.

Plot 14, Medan Bayan Lepas Technoplex
Phase 4 Bayan Lepas Industrial Zone
11900 Bayan Lepas, Penang
Malaysia