Solder Ball Mounting Machines for WLCSP & Flip Chip Packaging
Ball mounting is a sort of the most popular method to create solder bumps onto a high I/O substrate like a semiconductor wafer. In comparison with the other types of soldering method including laser soldering, this type of process shows better performance for a high I/O substrate. Our ball mounting machine has 4 process steps:
- Wafer handling from FOUP by a Robot
- Flux printing
- Ball mounting
Depending on the requirement, you could choose from these functional modules and a customized machine is able to be built. Besides the solder ball mounting, we provide reflow process as a part of bumping service.
Solder Ball Mounting Equipment
SB² – Jet
SB²-Jet is the machine with the highest placement precision and smallest solder ball capability.
SB² – SM
The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.
Ultra – SB²
Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.
SB² – M
SB2-M is an entry point for R&D with a small footprint and lower investment.
SB² – Compact
SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.