Ball mounting is a sort of the most popular method to create solder bumps onto a high I/O substrate like a semiconductor wafer. In comparison with the other types of soldering method including laser soldering, this type of process shows better performance for a high I/O substrate. Our ball mounting machine has 4 process steps:
Depending on the requirement, you could choose from these functional modules and a customized machine is able to be built. Besides the solder ball mounting, we provide reflow process as a part of bumping service.