SEQUENTIAL SOLDER BALL ATTACH MACHINE
SB² – SM
Being a lower cost version of the SB²-Jet without compromising its placement accuracy, the SB²-SM is a sequential solder ball attach and laser reflow system that can operate either in a fully automatic or in a semiautomatic mode. With larger work area than the SB²-M, yet relatively compact foot print than the SB²-Jet, it is ideal for research & development, prototyping and small volume manufacturing.
Highlights
- Jet mode/Standard mode
- Available solder ball diameter: 60 – 760μm
Suitable for chip/wafer/substrate soldering
- Optional ball rework (de-balling & re-balling) capability
Options
- Solder Ball Rework Station
- Pattern Recognition and Fiducial Alignment
- Upgrade to 8” working area
- Heated chuck/work stage
- Specific heated work holder for BGA-like devices
- Automatic Z-height measurement
Benefits
- High flexibility
- Small solder ball handleability
- Rework function
SB² – SM Products & Applications
Products
- Wafer Ø up to 8″
- Substrates
- Single Chips
- MEMS & 3D Package
- Hard Disk Drive (HDD)
- CMOS Sensors
- Opto-Electronics
- Microoptics
Filter Devices
(SAW, BAW, F-BAR)
Applications
- Prototype Build
- Repair/Rework
- Single Chip
- Wafer Level Chip Scale Packaging (WLCSP)
- Flip Chip
- Ball Grid Array (BGA)
- Printed Circuit Board (PCB)
