LAPLACE ® – LAR 600A
The LAPLACE ® LAR 600A revolutionizes reflow soldering with laser-assisted technology, offering faster reflow times, reduced thermal stress, and improved efficiency for a wide range of applications, while minimizing energy use and CO₂ emissions.
LAPLACE ® – CPT
Laser Bonding System (LAB) with compression bonding and laser assisted reflow.
SB² ® – USP
Highly flexible laser soldering and assembly platform for SMT components, especially for high-volume production in the automotive industry.
SB² ® – Jet
SB² ® - Jet is the machine with the highest placement precision and smallest solder ball capability.
SB² ® – Compact
SB² ® – Compact machine is the SB² ® entry point for high volume production with highly flexible and ultra-compact workstation.
Ultra-SB² ®
Ultra-SB² ® is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.
PACLINE ®
The PACLINE ® 300 A50 is a fully automated machine for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.
LAPLACE ® – Can
Ultra-fine-pitch cantilever assembly and laser bonding for wafer probe cards with optional rework capability.
LAPLACE ® – HT
The LAPLACE ® - HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.
LAPLACE ® – VC
The LAPLACE ® - VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in wafer packs.
SB² ® – WB
SB² ® - WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.
LAPLACE ® – FC
The LAPLACE ® - FC provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.
SB² ® – SMs Quantum
SB² ® - SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.
SB² ® – SM
The SB² ® - SM is a machine for prototyping and small volume production that has wider working area than the SB² ® - M and more optional features.
