Laser Soldering Machines for Advanced Packaging of Chips/Dies2023-01-30T10:41:55+01:00

Laser Soldering Machines for Advanced Packaging of Chips/Dies

Soldering is one of the most common process in the various industries such as semiconductor, electrical component, optical component, and more. Despite the long history of the process, soldering is still to the best way to get robust mechanical and electrical interconnection even today.

Our unique soldering solution “Solder Jetting / Jet Mode” provides you a wide range of flexibility that allow you to deal with the difficulties stem from the nature of your products.

Depending on the condition of the products, you can also choose the soldering mode “Standard Mode” that even expand the capability of the machines.

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Laser Soldering Equipment
Laser Soldering Comparison2023-01-24T23:56:25+01:00

Laser Soldering Comparison

Solder Wire

  • Fluxless soldering
  • Higher precision solder volume control by solder ball nature
  • Lower thermal stress
Solder Wiring PT

Stencil Printing

  • Fluxless soldering
  • Higher precision solder volume control by solder ball nature
  • Lower thermal stress
Stencil Printing PT

Ball Drop

  • Fluxless soldering
  • No stencil required
  • Support multiple solder alloy on same wafer
  • Cheap and flexible process for R&D and prototyping
  • Lower thermal stress
  • Ball placement on surface with topography
  • No additional reflow after ball placement
Ball Drop PT

Mini Wave Soldering / Selective Soldering

  • Fluxless soldering
  • Higher precision solder volume control
  • Higher selectivity
  • Better flexibility against more complex terrain
Mini Wave Soldering Selective Soldering
Laser Soldering Benefits2023-01-24T23:57:54+01:00

Laser Soldering Benefits

  • Fluxless
  • Mask/Stencil-less
  • Clean
  • Precision
  • 3D Soldering
  • Low Thermal Stress
Laser Soldering Video Demonstration2023-01-24T23:58:16+01:00

Laser Soldering Video Demonstration

This video demonstrates the laser soldering process using our SB²-Jet machine.

Laser Soldering Applications2023-01-24T23:58:38+01:00

Laser Soldering Applications

  • Wafer Level
  • Wafer Level Chip Scale Packaging (WLCSP)
  • Single Chip
  • Optoelectronics/Microoptics
  • Rework/Repair of BGA-like-Packages
  • MEMS & 3D-Packaging
  • Printed Circuit Board (PCB)
  • Hard Disk Drive (HGA, HSA, Hook-Up, Spindle-Motor)
  • Camera Modules
  • CMOS Sensors
  • BGA/cLCC Balling
  • Filter Devices (SAW, BAW, F-BAR)

Laser Soldering Process

Choose the bonding mode that best suits your application.

Jet Mode

  • Higher throughput
  • 3D Soldering is possible
  • Can handle smaller balls

Standard Mode

  • Better energy efficiency
  • For process with flux / For heavily oxidized pads

Laser Soldering Equipment


SB² – Jet

SB²-Jet is the machine with the highest placement precision and smallest solder ball capability.


SB² – SM

The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.


SB² – WB

SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.



Highly flexible laser soldering and assembly platform for SMT components, especially for high-volume production in the automotive industry.


SB² – SMs Quantum

SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.


SB² – Compact

SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.


LaPlace – HT

The LaPlace-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.

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