AUTOMATIC LASER SOLDERING ASSEMBLY MACHINE
LaPlace – HT
The LAPLACE-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules. The automatic machine punches and forms lead frames, dispenses solder paste and performs diode laser attach to the lead frame. A final electrical and visual test is done on the assembled modules and chip packages within the machine.
Highlights
- Reel-to-reel cutting system for metal lead frame
- Pick and place unit for punched metal parts and assembled parts
- High speed paste dispense
- Diode pick up from die feeder
- Laser soldering
- Electrical test
- Optical test
Benefits
- Automated Processes
LaPlace – HT Products & Applications
Products
- Bypass Diode for Solar Cells
RFID
LED
Applications
- Chips on Lead Frame
- LED Assembly
- µLED assembly
