Wafer dicing is the process by which individual silicon chips (die) are separated from each other on the wafer. The dicing process is accomplished by mechanically sawing the wafer in the extra areas between the die (often referred to as either dicing streets or scribe lines).
Electroplating, or electrochemical deposition, is the process of using electrodeposition to coat an object in a layer of metal(s) on any substrate. RDL and Copper for example, are part of this process.
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