Advanced Packaging Machines for the Automotive Industry

In the automotive industry, it is important that any electronic components function reliably and properly. For ideal processing in the field of advanced packaging of, for example, LED, LIDAR or PDC, PacTech offers suitable equipment for applications such as:

  • Flip Chip (FC)

  • Wafer Level Chip Scale Packaging (WLCSP)

  • Single Chip (SC)

PacTech’s products allow for a high degree of precision and performance in advanced packaging applications. Take a look at our equipment below to learn more about our products for the automotive industry and how you can benefit your business.

Advanced Packaging for Automotive Sector

Equipment for the Automotive Industry

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SB²-SM

SB² – SM

The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

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LaPlace-VC

LaPlace – VC

The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in wafer packs.

2024-07-31T12:03:08+02:00
SB²-Jet

SB² – Jet

SB²-Jet is the machine with the highest placement precision and smallest solder ball capability.

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SB²-WB

SB² – WB

SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.

2024-07-31T12:02:33+02:00
SB²-Compact

SB² – Compact

SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

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SB²-USP

SB² – USP

Highly flexible laser soldering and assembly platform for SMT components, especially for high-volume production in the automotive industry.

2024-08-01T04:49:48+02:00
SB²-Sms Quantum

SB² – SMs Quantum

SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.

2024-07-31T11:59:06+02:00
LaPlace-FC - Equipment

LaPlace – FC

The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.

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PacLine

PacLine

The PacLine 300 A50 is a fully automated machine for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.

2024-08-01T04:51:45+02:00
Ultra - SB² 300

Ultra – SB²

Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.