LASER BONDER MACHINE FOR VERTICAL ATTACHMENT

LaPlace – VC

The “LAPLACE-VC” laser bonder is a system suited for the vertical attachment of chips or similar devices loaded into the machine in wafer packs to various carrier substrates loaded manually onto the machine’s work stage.

The system uses a unique patented laser thermode tool, which is integrated in the vacuum pick and place unit of the bonder. Due to the high flexibility of the laser thermode, the system requires only a thin layer of solder on the substrate.

Highlights

In-Line capability
High throughput
Rotation correction and automatic alignment

Options

Wafer Handling Systems
Dispenser System
Substrate Feeder
Direct Die Feeder
UV Curing

Benefits

In-Line capability
High throughput
Available with different accuracy specs: ±25µm (standard), ±5µm, ±10µm (optional)
Vision system
Rotation correction and automatic alignment
90 degree flip unit to present Die to the bonding tool
Temperature control unit
Laser class 1 certified tool