Advanced Packaging Machines for the Production and Assembly Industry

In the production and assemlby industry, it is important that any electronic components function reliably and properly. For ideal processing in the field of advanced packaging of, for example, computer hardware components, PacTech offers suitable equipment for applications such as:

  • Flip Chip (FC)
  • Wafer Level Chip Scale Packaging (WLCSP)
  • Single Chip (SC)

PacTech’s products allow for a high degree of precision and performance in advanced packaging applications. Take a look at our equipment for production and assembly applications below to learn more about our products and how you can benefit your business.

Get in Contact with Sales
Advanced Packaging for Production and Assembly Sector

Equipment for the Production/Assembly Industry

2024-01-08T10:38:16+01:00

LaPlace – FC

The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.

2023-02-07T10:00:35+01:00

SB² – Jet

SB²-Jet is the machine with the highest placement precision and smallest solder ball capability.

2023-05-31T10:33:30+02:00

SB² – USP

Highly flexible laser soldering and assembly platform for SMT components, especially for high-volume production in the automotive industry.

2023-01-27T10:42:20+01:00

SB² – WB

SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.

2023-03-17T09:32:42+01:00

SB² – SM

The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

2023-01-27T11:04:22+01:00

SB² – Compact

SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

2023-01-27T11:13:27+01:00

SB² – SMs Quantum

SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.

2023-01-27T10:37:53+01:00

LaPlace – HT

The LaPlace-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.

2024-05-07T12:16:08+02:00

LaPlace – VC

The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in wafer packs.