Advanced Packaging Machines for the Production and Assembly Industry
In the production and assemlby industry, it is important that any electronic components function reliably and properly. For ideal processing in the field of advanced packaging of, for example, computer hardware components, PacTech offers suitable equipment for applications such as:
- Flip Chip (FC)
- Wafer Level Chip Scale Packaging (WLCSP)
- Single Chip (SC)
PacTech’s products allow for a high degree of precision and performance in advanced packaging applications. Take a look at our equipment for production and assembly applications below to learn more about our products and how you can benefit your business.
Equipment for the Production/Assembly Industry
SB² – SMs Quantum
SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.
SB² – M
SB2-M is an entry point for R&D with a small footprint and lower investment.
SB² – USP
Highly flexible laser soldering and assembly platform for SMT components, especially for high-volume production in the automotive industry.
SB² – Jet
SB²-Jet is the machine with the highest placement precision and smallest solder ball capability.
LaPlace – HT
The LaPlace-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.
SB² – WB
SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.
LaPlace – VC
The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in waffle packs.
SB² – Compact
SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.
LaPlace – FC
The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.
SB² – SM
The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.