HIGH-SPEED SOLDER BALL ATTACH AND LASER REFLOW MACHINE

Flagship platform of PacTech’s leading edge solder jetting technology with the high precision gantry is the most advanced system for automated high-speed sequential solder ball attach and laser reflow. With accurate, precise and reliable performance proven in mass volume production environment, the large working area of this model is highly flexible for a variety of different microelectronic substrates and applications. A comprehensive version of the SB² ^® – Jet is delivered with a vision and pattern-recognition system, an after-bump 2D inspection and an additional repair unit, with optional automated substrate or wafer handling solution customizable to support customer-specific products and carriers such as conveyor, robot or reel-to-reel system, this machine is ready for in-line production integration.