2025-09-19T06:30:39+02:00

LAPLACE ® – LAR 600A

The LAPLACE ® LAR 600A revolutionizes reflow soldering with laser-assisted technology, offering faster reflow times, reduced thermal stress, and improved efficiency for a wide range of applications, while minimizing energy use and CO₂ emissions.

2025-09-19T09:32:24+02:00

SB² ® – USP

Highly flexible laser soldering and assembly platform for SMT components, especially for high-volume production in the automotive industry.

2025-09-19T09:44:52+02:00

SB² ® – Jet

SB² ® - Jet offers the highest placement precision of all PacTech machines and is capable of processing the smallest solder balls in the portfolio.

2025-09-19T10:11:32+02:00

SB² ® – Compact

SB² ® – Compact machine is the SB² ® entry point for high volume production with highly flexible and ultra-compact workstation.

2025-09-19T04:33:06+02:00

Ultra-SB² ®

Ultra-SB² ® is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.

2025-09-19T03:59:09+02:00

PACLINE ®

The PACLINE ® 300 A50 is a fully automated machine for electroless deposition of Ni/Au, NiPd or NiPdAu bumps on semiconductor wafers.

2025-09-19T08:21:11+02:00

LAPLACE ® – Can

Ultra-fine-pitch cantilever assembly and laser bonding for wafer probe cards with optional rework capability.

2025-09-19T08:41:05+02:00

LAPLACE ® – HT

The LAPLACE ® - HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.

2025-09-19T08:52:38+02:00

LAPLACE ® – VC

The LAPLACE ® - VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in wafer packs.

2025-09-19T10:45:15+02:00

SB² ® – WB

SB² ® - WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.

2025-09-19T09:06:53+02:00

LAPLACE ® – FC

The LAPLACE ® - FC provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.

2025-09-19T11:01:22+02:00

SB² ® – SMs Quantum

SB² ® - SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.

2025-09-19T11:14:30+02:00

SB² ® – SM

The SB² ® - SM is a machine for prototyping and small volume production that has wider working area than the SB² ® - M and more optional features.