Laser Soldering Machines for Advanced Packaging of Chips/Dies
Soldering is one of the most common process in the various industries such as semiconductor, electrical component, optical component, and more. Despite the long history of the process, soldering is still to the best way to get robust mechanical and electrical interconnection even today.
Our unique soldering solution “Solder Jetting / Jet Mode” provides you a wide range of flexibility that allow you to deal with the difficulties stem from the nature of your products.
Depending on the condition of the products, you can also choose the soldering mode “Standard Mode” that even expand the capability of the machines.
![Laser Soldering Equipment Laser Soldering Equipment](https://pactech.com/wp-content/uploads/2022/11/L1A5796-1200x800-1.webp)
Laser Soldering Comparison
Solder Wire
![Solder Wiring PT Solder Wiring PT](https://pactech.com/wp-content/uploads/2022/11/solder-wire.jpg-600x250-1.webp)
Stencil Printing
![Stencil Printing PT Stencil Printing PT](https://pactech.com/wp-content/uploads/2022/11/Stencil-Printing-PT-1-600x250-1.webp)
Ball Drop
![Ball Drop PT Ball Drop PT](https://pactech.com/wp-content/uploads/2022/11/Ball-Drop-PT-1-600x250-1.webp)
Mini Wave Soldering / Selective Soldering
![Mini Wave Soldering Selective Soldering Mini Wave Soldering Selective Soldering](https://pactech.com/wp-content/uploads/2022/11/mini-wave-soldering_selective-soldering.JPG-600x250-1.webp)
Laser Soldering Video Demonstration
This video demonstrates the laser soldering process using our SB²-Jet machine.
Laser Soldering Process
Choose the bonding mode that best suits your application.
Jet Mode
Standard Mode
Laser Soldering Equipment
SB² – SMs Quantum
SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.
SB² – Jet
SB²-Jet is the machine with the highest placement precision and smallest solder ball capability.
SB² – SM
The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.
LaPlace – HT
The LaPlace-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.
SB² – Compact
SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.
SB² – WB
SB²-WB is a combination of PacTech’s unique solder ball jetting machines with a wire feeding mechanism to perform wiring process.
SB² – USP
Highly flexible laser soldering and assembly platform for SMT components, especially for high-volume production in the automotive industry.