Cantilever Assembly and Laser Bonding Machine – LAPLACE-Can

Our solution for ultra-fine-pitch cantilever assembly and laser bonding for wafer probe cards with optional rework capability.

This platform is also suited for the vertical attachment of chips or similar devices loaded into the machine from feeding station to various carrier substrates loaded manually onto the machine’s work stage. The system uses a unique patented laser thermode tool, which is integrated in the vacuum pick and place unit of the bonder. For the high flexibility of the laser thermode, the system requires only a thin layer of solder on the substrate.

Highlights

  • Placement accuracy: ≤ +/- 5µm

  • Probe card sizes up to 13 inch
  • Full process control
  • Alignment control by position bonding

For more information about the LAPLACE-Can, you can request the official brochure below.

Applications

  • Wafer Probe Cards

Options

  • Cantilever repair

Benefits

  • Height control accuracy: ≤ 5µm
  • Cantilever thickness: 20 – 100µm
  • Pitch: down to 60µm

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