Skip to content
PacTech – Packaging Technology Equipment & Services Logo PacTech – Packaging Technology Equipment & Services Logo
  • HOME
  • INFORMATION
    • ABOUT PACTECH
    • EVENTS & EXHIBITIONS
    • PRESS RELEASE
    • CAREER / JOBS
    • PUBLICATIONS
    • LOCATIONS & CERTIFICATES
    • MEDIA LIBRARY
  • EQUIPMENT

    • BY PROCESS
      • Laser Soldering
      • Laser Assisted Bonding
      • Electroless Plating
      • Solder Ball Mounting
      • Wire Soldering

    • BY APPLICATION
      • 3D and 3.5D ® Packaging
      • Flip Chip
      • Probe Card
      • Reballing
      • SMT

    • BY SECTOR
      • Aerospace
      • Automotive
      • Consumer Electronics
      • Energy and Solar
      • Medical
      • Production and Assembly
    • SB2 RSP Machine

    • PRODUCT FAMILY
      • SB² ®
      • LAPLACE ®
      • Ultra-SB² ®
      • PACLINE ®
  • WLP SERVICE
    • Electroless Plating

      Electroless Plating

      Electroless Plating – Maskless chemical deposition of metal stacks on wafers as intermetallic connection or to enhance product reliability.

    • Electroplating

      Electroplating

      Electroplating is the process of using electrodeposition to coat an object in a layer of metal(s) on any substrate.

    • Copper Pillar

      Copper Pillar

      Electroplated Cu pillar with optional Ni diffusion barrier and SnAg cap for low cost and fine-pitch flip chip interconnects.

    • Redistribution Layer (RDL)

      Redistribution Layer (RDL)

      Rerouting of pads on a die with metal and dielectric layers to the other locations to fulfil the subsequent packaging rules.

    • Solder Balling

      Solder Balling

      Various solder deposition technologies to form solder bump for wafer level chip scale packaging and flip chip interconnects.

    • Laser Assisted Bonding

      Laser Asssisted Bonding

      Laser assisted bonding is an interconnection method performed through the laser energy to bond two surfaces of materials together.

    • Wafer Level Component Assembly

      Wafer Level Component Assembly

      We offer wafer level component assembly by attaching dies, chips or various passive components like capacitors on a wafer surface.

    • Wafer Thinning

      Wafer Thinning

      Removal of wafer backside materials for thinner die in final packaging via high quality mechanical polishing and chemical stress relief.

    • Wafer Metal Coating

      Wafer Metal Coating

      Application of various metal stacks via evaporation or sputtering technologies on wafer backside for better die performance.

    • Wafer Dicing

      Wafer Dicing

      Wafer dicing is the process where silicon chips (die) are separated from each other on the wafer, accomplished by mechanically sawing.

  • CHEMICALS
  • CONTACT
    • Contact
    • Global Sales Team
  • CUSTOMER CENTER
  • English
    • Deutsch (German)
    • 日本語 (Japanese)
    • 한국어 (Korean)
    • 简体中文 (Chinese (Simplified))
    • 繁體中文 (Taiwanese)
  • HOME
  • ABOUT
    • ABOUT PACTECH
    • EVENTS & EXHIBITIONS
    • PRESS RELEASE
    • CAREER / JOBS
    • PUBLICATIONS
    • LOCATIONS & CERTIFICATES
    • MEDIA LIBRARY
  • EQUIPMENT
    • BY PROCESS
      • Laser Soldering
      • Laser Assisted Bonding
      • Electroless Plating
      • Solder Ball Mounting
      • Wire Soldering
    • BY APPLICATION
      • 3D and 3.5D ® Packaging
      • Flip Chip
      • Probe Card
      • Reballing
      • SMT
    • BY SECTOR
      • Aerospace
      • Automotive
      • Consumer Electronics
      • Energy and Solar
      • Medical
      • Production and Assembly
    • PRODUCT FAMILY
      • SB² ®
      • LAPLACE ®
      • Ultra-SB² ®
      • PACLINE ®
  • WLP SERVICE
    • Electroless Plating
    • Electroplating
    • Copper Pillar
    • Redistribution Layer (RDL)
    • Solder Balling
    • Laser Asssisted Bonding
    • Wafer Level Component Assembly
    • Wafer Thinning
    • Wafer Metal Coating
    • Wafer Dicing
  • CHEMICALS
  • CONTACT
    • Contact
    • Global Sales Team
  • CUSTOMER CENTER
  • English
    • Deutsch (German)
    • 日本語 (Japanese)
    • 한국어 (Korean)
    • 简体中文 (Chinese (Simplified))
    • 繁體中文 (Taiwanese)
Previous Next

LAPLACE ® Technical Articles

  • A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding
Tan Shing Yee2025-05-05T08:58:31+02:00

NEWSLETTER

NAVIGATION

Jobs

Press Release

Contact

Locations

Imprint

Terms & Conditions

Privacy Policy

Cookie Policy

© PacTech - Packaging Technologies GmbH 2012 - 2025 | All Rights Reserved |
  Member Of NAGASE Group
LinkedInYouTube
Page load link
PacTech - Packaging Technology Equipment & Services
Manage Cookie Consent
To provide the best experiences, we use technologies like cookies to store and/or access device information. Consenting to these technologies will allow us to process data such as browsing behavior or unique IDs on this site. Not consenting or withdrawing consent, may adversely affect certain features and functions.
Functional Always active
The technical storage or access is strictly necessary for the legitimate purpose of enabling the use of a specific service explicitly requested by the subscriber or user, or for the sole purpose of carrying out the transmission of a communication over an electronic communications network.
Preferences
The technical storage or access is necessary for the legitimate purpose of storing preferences that are not requested by the subscriber or user.
Statistics
The technical storage or access that is used exclusively for statistical purposes. The technical storage or access that is used exclusively for anonymous statistical purposes. Without a subpoena, voluntary compliance on the part of your Internet Service Provider, or additional records from a third party, information stored or retrieved for this purpose alone cannot usually be used to identify you.
Marketing
The technical storage or access is required to create user profiles to send advertising, or to track the user on a website or across several websites for similar marketing purposes.
  • Manage options
  • Manage services
  • Manage {vendor_count} vendors
  • Read more about these purposes
View preferences
  • {title}
  • {title}
  • {title}
PacTech - Packaging Technology Equipment & Services
Manage Cookie Consent
To provide the best experiences, we use technologies like cookies to store and/or access device information. Consenting to these technologies will allow us to process data such as browsing behavior or unique IDs on this site. Not consenting or withdrawing consent, may adversely affect certain features and functions.
Functional Always active
The technical storage or access is strictly necessary for the legitimate purpose of enabling the use of a specific service explicitly requested by the subscriber or user, or for the sole purpose of carrying out the transmission of a communication over an electronic communications network.
Preferences
The technical storage or access is necessary for the legitimate purpose of storing preferences that are not requested by the subscriber or user.
Statistics
The technical storage or access that is used exclusively for statistical purposes. The technical storage or access that is used exclusively for anonymous statistical purposes. Without a subpoena, voluntary compliance on the part of your Internet Service Provider, or additional records from a third party, information stored or retrieved for this purpose alone cannot usually be used to identify you.
Marketing
The technical storage or access is required to create user profiles to send advertising, or to track the user on a website or across several websites for similar marketing purposes.
  • Manage options
  • Manage services
  • Manage {vendor_count} vendors
  • Read more about these purposes
View preferences
  • {title}
  • {title}
  • {title}
Go to Top