Localized Laser Heating: Prevents excessive thermal exposure to surrounding areas, reducing warpage and stress.
Flexible Laser Beam Shaping: Allows precise heat distribution tailored to different interconnection needs.
High Placement Accuracy: Ensures precise alignment and bonding for fine-pitch applications.
In-Situ Reflow Technology: Achieves solder reflow at the bonding interface for enhanced intermetallic formation and joint reliability.
CTE-Mismatch Handling: Ideal for bonding materials with different thermal expansion coefficients, reducing stress-related failures.
