| Feature | Laser Assisted Bonding (LAB) | Thermo Compression Bonding (TCB) |
|---|---|---|
| Heating Application Method | Localized, modulated laser beam heats only the required area and primary the interface optically | Tool-wide, bonding tool heats via a heating element and transfers heat to the substrate |
| Heat Measurement | Contactless optical heat measurement directly on the substrate | Contact sensor measures heat at tool heater |
| Tool Expansion | No tool expansion | Requires additional calibration steps due to tool expansion from heat |
| Post-Placement Process | Can transition to contactless laser reflow for self-alignment of substrates | N/A |
| Process Dynamics | Faster heating and cooling, leading to improved UPH and smoother process flow | Slower heating and cooling, impacting UPH |
| Bonding Accuracy | Higher accuracy due to minimal substrate warpage | Affected by tool expansion and substrate warpage CTE caused offset must be considered in substrate layout |
| Metallurgy | Small IMC (500nm-1.2µm). Higher ratio of ductile material remain in solder joint. Longer product life-time | Large IMC (3-6µm) Problem for further miniaturization of solder based interconnects ≤16µm |
| Substrate Configuration | 2D and 3D substrates Horizontal and vertical die attach | 2D substrates Horizontal die attach |
| Mechanical Force | No or low compression force necessary. Low level of mechanical induced stress. | High compression force necessary to form joints High level of mechanical induced stress |
