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    • Electroless Plating

      Electroless Plating

      Electroless Plating – Maskless chemical deposition of metal stacks on wafers as intermetallic connection or to enhance product reliability.

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      Electroplating

      Electroplating is the process of using electrodeposition to coat an object in a layer of metal(s) on any substrate.

    • Copper Pillar

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      Electroplated Cu pillar with optional Ni diffusion barrier and SnAg cap for low cost and fine-pitch flip chip interconnects.

    • Redistribution Layer (RDL)

      Redistribution Layer (RDL)

      Rerouting of pads on a die with metal and dielectric layers to the other locations to fulfil the subsequent packaging rules.

    • Solder Balling

      Solder Balling

      Various solder deposition technologies to form solder bump for wafer level chip scale packaging and flip chip interconnects.

    • Laser Assisted Bonding

      Laser Asssisted Bonding

      Laser assisted bonding is an interconnection method performed through the laser energy to bond two surfaces of materials together.

    • Wafer Level Component Assembly

      Wafer Level Component Assembly

      We offer wafer level component assembly by attaching dies, chips or various passive components like capacitors on a wafer surface.

    • Wafer Thinning

      Wafer Thinning

      Removal of wafer backside materials for thinner die in final packaging via high quality mechanical polishing and chemical stress relief.

    • Wafer Metal Coating

      Wafer Metal Coating

      Application of various metal stacks via evaporation or sputtering technologies on wafer backside for better die performance.

    • Wafer Dicing

      Wafer Dicing

      Wafer dicing is the process where silicon chips (die) are separated from each other on the wafer, accomplished by mechanically sawing.

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  • HOME
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    • EVENTS & EXHIBITIONS
    • PRESS RELEASE
    • CAREER / JOBS
    • PUBLICATIONS
    • LOCATIONS & CERTIFICATES
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  • EQUIPMENT
    • BY PROCESS
      • Laser Soldering
      • Laser Assisted Bonding
      • Electroless Plating
      • Solder Ball Mounting
      • Wire Soldering
    • BY APPLICATION
      • 3D and 3.5D ® Packaging
      • Flip Chip
      • Probe Card
      • Reballing
      • SMT
    • BY SECTOR
      • Aerospace
      • Automotive
      • Consumer Electronics
      • Energy and Solar
      • Medical
      • Production and Assembly
    • PRODUCT FAMILY
      • SB² ®
      • LAPLACE ®
      • Ultra-SB² ®
      • PACLINE ®
  • WLP SERVICE
    • Electroless Plating
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    • Redistribution Layer (RDL)
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Previous

SB² ® Technical Articles

  • Forming of advanced THT-interconnects using SB² ® laser solder jetting process
Tan Shing Yee2025-07-01T10:39:40+02:00

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