Surface Mount Technology (SMT) Equipment
Surface Mount Technology (SMT) is one of the principal method to be used for assembling electronic components onto a substrate such as Printed Circuit Board (PCB). The device assembled with that method is called as Surface Mount Device (SMD).
In many cases, the components such as a capacitor is placed in appropriate position with mounter equipment, and the substrate is heated by a reflow oven to form a solder interconnection. This process expects high throughput, however, it gives too much thermal stress to the substrate as a downside.
Our laser assisted bonding equipment provides you a low thermal stress bonding process. It allows you to process following objects:
- Substrate has devices/components that easily affected by heat
- Substrate itself shows heat-sensitive characteristics
SMT Equipment
LAPLACE-FC
The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.
Ultra-SB² 300
Ultra-SB2 is a fully automated solder bumping equipment integrating flux printing, ball placement, 2D inspection and wafer level rework.
LAPLACE-VC
The LaPlace-VC laser bonder is a system for the vertical attachment of chips or similar devices loaded into the machine in waffle packs.
