SEQUENTIAL SOLDER BALL ATTACH MACHINE

SB² ® – SM

Being a lower cost version of the SB² ® – Jet without compromising its placement accuracy, the SB² ® – SM is a sequential solder ball attach and laser reflow system that can operate either in a fully automatic or in a semiautomatic mode. With larger work area than the SB² ® – M , yet relatively compact foot print than the SB² ® – Jet, it is ideal for research & development, prototyping and small volume manufacturing.

Highlights

  • Jet mode/Standard mode
  • Available solder ball diameter: 60 – 760μm

  • Suitable for chip/wafer/substrate soldering

  • Optional ball rework (de-balling & re-balling) capability
Options
  • Solder Ball Rework Station
  • Pattern Recognition and Fiducial Alignment
  • Upgrade to 8” working area
  • Heated chuck/work stage
  • Specific heated work holder for BGA-like devices
  • Automatic Z-height measurement
Benefits
  • High flexibility
  • Small solder ball handleability
  • Rework function
SB²-SM

SB² ® – SM  Products & Applications

Products

  • Wafer Ø up to 8″
  • Substrates
  • Single Chips
  • MEMS & 3D Package
  • Hard Disk Drive (HDD)
  • CMOS Sensors
  • Opto-Electronics
  • Microoptics

  • Filter Devices
    (SAW, BAW, F-BAR)

Applications

  • Prototype Build
  • Repair/Rework
  • Single Chip
  • Wafer Level Chip Scale Packaging (WLCSP)
  • Flip Chip
  • Ball Grid Array (BGA)
  • Printed Circuit Board (PCB)
Advanced Packaging for Production and Assembly Sector

SB² ® – Product Chart

SB2-Product-Chart