Probe Card Machines for Semiconductor Chips and Modules

Probe card is one of the most important key component to produce highly reliable semiconductor chips and modules. It acts as an interface between a tester and these semiconductor devices to let the tester to give a series of electrical signals for testing.

Currently, more attention is being paid to MEMS-type probe technology to meet the trend toward higher density.

PacTech offers you to an automated MEMS cantilever probe assembly solution:

  • High precision solder deposition with solder balls

  • Automated laser assisted bonder with high precision for MEMS cantilever assembly

Advanced Packaging Machine from the inside

Probe Card Equipment

2026-02-23T03:38:24+01:00
SB²-Jet

SB² ® – Jet

SB² ® - Jet offers the highest placement precision of all PacTech machines and is capable of processing the smallest solder balls in the portfolio.

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2026-02-24T03:37:38+01:00
LaPlace-Can

LAPLACE ® – 3.5D ®

The LAPLACE ® - 3.5D ® laser-assisted bonding platform is our solution for ultra-fine-pitch cantilever assembly on wafer probe cards with optional rework capability.

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