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Advanced Packaging Equipment
Solder Bumping
Solder Rework
Wafer Level Packaging
e-Ni/Au Plating
Backend & Assembly |
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PAC TECH provides state-of-the-art automated equipment to the Wafer Level Packaging and Backend Industries. This equipment is divided into three separate platforms: e-Ni/Au Plating, Solder Bumping, and Backend Assembly.
The fully automatic electroless nickel plating line (PACLINE™ Series 200 and 300) allows the processing of 100-300mm wafers with Ni, Pd, and Au at volumes of 600,000 parts per year. In addition, PAC TECH offers the peripheral equipment associated with electroless plating, including: plasma clean (PlasPac), resist and dielectric coating (SpinPac), megasonic solvent cleaning (MegaPac).
PAC TECH offers two different equipment platforms for solder deposition. These include the Laser Assisted Solder Jetting (SB²) and the Wafer Level Solder Balling (Ultra-SB²) machines. The SB²-Jet is ideal for processing MEMS, Military, and Medical applications; as well as single die, probe cards, substrates, Hard Disc Drive heads and camera modules. The Wafer Level Solder Balling equipment is ideal for high yield and high volume bumping applications.
To facilitate a full turn key solution to their equipment line, PAC TECH offers a full set of additional equipment for Wafel Level Packaging and Backend appplications, including: laser based assembly tools LAPLACE™-FC, LAPLACE-CAP, LAPLACE-CAN, Laser Marking (LS²) and Reflow Oven.
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