ELECTROPLATING SERVICE

ELECTROPLATING SERVICE

Wafer Level Chip Scale Packaging (WLCSP) is becoming more prevalent as industry demands smaller and thinner microelectronic packages. WLCSP allows smaller form factors, improved electrical performance and a relatively simpler structure over conventional wire bond or interposer packaging technologies. PacTech offers state-of-the-art wafer bumping and WLCSP solutions such as RDL and copper pillar plating:

  • Cu pillar bumping with bump diameters as small as 25 microns

  • Possible metal stacks for pillar Cu, Cu/SnAg, Cu/Ni/SnAg

  • Bump-on-pad and bump-on-polymer processes

  • Single and multiple layer Cu redistribution with several polymer repassivation material choices

  • Applicable on Silicon, Glass and GaN substrates, 100mm to 200mm wafer

RDL Redistribution Layer

WAFER LEVEL PACKAGING SERVICES

Electroplating

Electroplating, or electrochemical deposition, is the process of using electrodeposition to coat an object in a layer of metal(s) on any substrate. RDL and Copper for example, are part of this process.

Electroless-Plating

Low-cost mask-less chemical deposition of various metal stacks on wafer surface to serve as intermetallic connection or to enhance product reliability and performance.

Laser Assisted Bonding

Laser assisted bonding is an interconnection method performed through the laser energy to bond two surfaces of materials together.

Solder Balling

Various solder deposition technologies to form solder bump for WLCSP and flip chip interconnects.

Wafer Level Component Assembly

Wafer level assembly by attaching of dies or various passive components on wafer surface.

Wafer Thinning

Thinning of wafer backside for dies in final packaging.

Wafer Metal Coating

Application of various metal stacks via evaporation or sputtering technologies on wafer backside for better die performance.

Wafer Dicing

High precision and accurate singulation of dies on a wafer.