Project Description
SMT Robot for Solder Ball Attach and Laser Reflow – SB²-RSP
The SB²-RSP system is a flexible multi-functional robot soldering platform for automated angle-free laser soldering, especially for SMT components.. It features a variety of optionally selectable features, such as automatic substrate handling systems, pick-and-place of components from reel to substrate, solder paste dispensing and laser reflow, laser wire soldering, wire bonding and solder jetting, automatic fluxing, and several others.
The SB²-RSP system is a cost-efficient substitution for manual soldering processes in the field of SMT high-volume manufacturing.
Highlights
Soldering mode: Jet mode
Available solder ball diameter: 450 – 2,000μm
Recommended soldering condition: 2D/3D soldering
Suitable for substrate/component/module soldering with big solder ball
Laser solder jetting with 6-axes robot
Integrated pick-and-place of components from reel-to-substrate (optional)
In-line capability
Applications
- Automatic substrate handling systems, such as inline or magazine conveyor
- Pick-and-place of components from reel to substrate
- Customer-integrated-manufacturing-system implementation
- RFID/Data-matrix-code reading
- Solder paste dispensing and laser reflow
- Laser wire soldering
- Wire bonding and laser solder jetting
- Automatic fluxing by dispensing or dipping
- 2D post-bond inspection system
- ESD kit
- Heated chuck/work stage
- Variable laser power upgrades
Options
- Broad range of SMT applications
- PCB and panel-level solder bumping
- 3D soldering
- Through-Hole-Technology (THT) soldering
- Pin/pillar soldering
- MEMS & 3D-Packaging
- Automotive (LiDAR, Battery, LED)
- PowerLED
- Consumer electronics
- Mobile
Benefits
- Freely programmable soldering angles by 6-axis robot bond-head movement
- Large solder volumes up to 2mm solder ball diameter
PRODUCT CHART
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