Project Description
High-Speed Solder Ball Attach and Laser Reflow – SB²-Jet
The SB²-Jet provides fine-pitch soldering capability supported by a high accuracy axis system. It has the smallest solder ball diameter capability down to 40μm. it is ideal not only for research & development, prototyping of advanced devices but especially also for mass production.
Highlights
Soldering mode: Jet mode/Standard mode
Available solder ball diameter : 40 – 760μm
Recommended soldering condition: 2D soldering
Suitable for chip/wafer/substrate soldering
- In-line capability
Optional ball rework (de-balling & re-balling) capability
Applications
- Wafer Level (CSP & Flip Chip)
- Single Chip
- BGA/cLCC Balling
- Rework/Repair of BGA-like packages
- PCB
- MEMS & 3D-Packaging
- Hard Disk Drive
- Camera Modules
- CMOS Sensors
- Optoelectronics/Microoptics
Options
- Ball Inspection System (2-D)
- Automatic Z-Height Measurement
- ESD Kit
- Heated chuck/work stage
- Specific heated work holder for BGA-like devices
- Solder Ball Rework Station
- Automatic Wafer Handling System 6”-12”
- Automatic Reel to Reel System
- Automatic Inline Conveyor System
- Expand working area > 320x320mm
Benefits
- High accuracy
- Largest possible working area 320x320mm
- Small solder ball size capability
- Optional post vision inspection capability
PRODUCT CHART
RELATED SB²-PRODUCTS
SB²-SMs Quantum
SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.
SB²-Compact
SB²-Compact is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.
