Project Description

High-Speed Solder Ball Attach and Laser Reflow – SB²-Jet

The SB²-Jet provides fine-pitch soldering capability supported by a high accuracy axis system. It has the smallest solder ball diameter capability down to 40μm. it is ideal not only for research & development, prototyping of advanced devices but especially also for mass production.

Highlights

  • Soldering mode: Jet mode/Standard mode

  • Available solder ball diameter : 40 – 760μm

  • Recommended soldering condition: 2D soldering

  • Suitable for chip/wafer/substrate soldering

  • In-line capability
  • Optional ball rework (de-balling & re-balling) capability

For more information about the SB² – Jet, you can request the official brochure below.

Applications

  • Wafer Level (CSP & Flip Chip)
  • Single Chip
  • BGA/cLCC Balling
  • Rework/Repair of BGA-like packages
  • PCB
  • MEMS & 3D-Packaging
  • Hard Disk Drive
  • Camera Modules
  • CMOS Sensors
  • Optoelectronics/Microoptics

Options

  • Ball Inspection System (2-D)
  • Automatic Z-Height Measurement
  • ESD Kit
  • Heated chuck/work stage
  • Specific heated work holder for BGA-like devices
  • Solder Ball Rework Station
  • Automatic Wafer Handling System 6”-12”
  • Automatic Reel to Reel System
  • Automatic Inline Conveyor System
  • Expand working area > 320x320mm

Benefits

  • High accuracy
  • Largest possible working area 320x320mm
  • Small solder ball size capability
  • Optional post vision inspection capability

PRODUCT CHART

SB2 Product Chart

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