LASER BONDER MACHINE FOR VERTICAL ATTACHMENT

LAPLACE ® – 3.5D ®

The LAPLACE ® – 3.5D ® laser-assisted bonding platform is our solution for ultra-fine-pitch cantilever assembly on wafer probe cards with optional rework capability. Moreover, it is designed for the vertical attachment of chips and other semiconductor devices to extend conventional 3D chip packaging allowing greater design flexibility for heterogeneous integration. Ultra-short laser heating, enables low-stress bonding suitable for complex vertical interconnect architectures.

The system uses a unique patented laser thermode tool, which is integrated in the vacuum pick and place unit of the bonder.

Highlights

  • Placement accuracy: ≤ +/- 3µm

  • Substrate up to 13 inch

  • Height control accuracy: ≤ 5µm

  • Cantilever thickness: 20 – 100µm

  • Die thickness: min. 60µm

  • Pitch: down to 60µm (Cantilever)

  • Full process control

  • Alignment control by position bonding

Options

  • Repair by repositioning or replacement

LaPlace-Can

LAPLACE ® – 3.5D ® Products & Applications

Products

  • DRAM
  • Flash Memory
  • NAND

Applications

  • Vertical Chip Bonding
  • Cantilever Assembly
  • Wafer Probe Cards
Vertical Flip Chip Bonding