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hide_on_mobile="small-visibility,medium-visibility,large-visibility"][fusion_li_item]Wafer-Ebene[/fusion_li_item][fusion_li_item]Wafer Level Chip Scale Packaging (WLCSP)[/fusion_li_item][fusion_li_item]Einzelner Chip[/fusion_li_item][fusion_li_item]Optoelektronik/Mikrooptik[/fusion_li_item][fusion_li_item]Nacharbeit/Reparatur von BGA-ähnlichen Gehäusen[/fusion_li_item][fusion_li_item]MEMS & 3D-Packaging[/fusion_li_item][/fusion_checklist][/fusion_builder_column][fusion_builder_column type="1_2" type="1_2" layout="1_2" align_self="auto" content_layout="column" align_content="flex-start" valign_content="flex-start" content_wrap="wrap" center_content="no" column_tag="div" target="_self" hide_on_mobile="small-visibility,medium-visibility,large-visibility" sticky_display="normal,sticky" order_medium="0" order_small="0" hover_type="none" border_style="solid" box_shadow="no" box_shadow_blur="0" box_shadow_spread="0" z_index_subgroup="regular" background_type="single" 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transform_translate_y_hover="0" transform_rotate_hover="0" transform_skew_x_hover="0" transform_skew_y_hover="0" animation_direction="left" animation_speed="0.3" last="true" border_position="all" first="false" min_height="" link=""][fusion_checklist hide_on_mobile="small-visibility,medium-visibility,large-visibility"][fusion_li_item]Printed Circuit Board (PCB)[/fusion_li_item][fusion_li_item]Hard Disk Drive (HGA, HSA, Hook-Up, Spindle-Motor)[/fusion_li_item][fusion_li_item]Kamera-Module[/fusion_li_item][fusion_li_item]CMOS-Sensoren[/fusion_li_item][fusion_li_item]BGA/cLCC Balling[/fusion_li_item][fusion_li_item]Filtergeräte (SAW, BAW, F-BAR)[/fusion_li_item][/fusion_checklist][/fusion_builder_column][/fusion_builder_row][/fusion_builder_container]