新闻、出版物和公告
Forming of Advanced THT-Interconnects using SB² Laser Solder Jetting Process
Matthias Fettke, Gero Bonow, Anne Fisch, Moshir Nasser, Georg Friedrich, Rojhat Baba, Thorsten Teutsch
PacTech – Packaging Technologies
Am Schlangenhorst 7-9, 14641 Nauen, Germany
Fettke@pactech.de
Conventional methods of
Versatile Hermetically Sealed Sensor Platform for High Frequency Applications
By: Kevin Kröhnert, Markus Wöhrmann, Michael Schiffer, Georg Friedrich, Dzmitry Starukhin, Martin Schneider-Ramelow, Winfried Mayer, Tobias Chaloun, Thomas Galler, Christian Waldschmidt, Malte Schulz-Ruhtenberg, Norbert Ambrosius,
Reliability of Through Glass Vias and Hermetically Sealing for a Versatile Sensor Plattform
By: Kevin Kröhnert, Georg Friedrich, Dzmitry Starukhin, Markus Wöhrmann, Michael Schiffer, Martin Schneider-Ramelow.
In this work we present aspects of our versatile hermetically sealed sensor platform.
A Study About 3D Stacking of Passive SMD Elements for Advanced SMT Packaging Using Laser Assisted Bonding
By: Kevin Kröhnert, Georg Friedrich, Dzmitry Starukhin, Markus Wöhrmann, Michael Schiffer, Martin Schneider-Ramelow.
In this work we present aspects of our versatile hermetically sealed sensor platform.
