PacTech的出版物
著作 2023
Forming of advanced THT-interconnects using SB² laser solder jetting process
Next generation advanced packaging using innovative laser assisted bonding equipment
著作 2021
- Innovative laser assisted 3.5D and SB² WB assembly processes for next generation advanced packaging
- Versatile hermetically sealed sensor platform for high frequency applications
- Assembly and Repair of mini- and µ-LED display panels using innovative laser assisted bonding
- Lasergestützte Fügeprozesse als Schlüsseltechnologie der zukünftigen Aufbau- und Verbindungstechnik
- Laser-assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures
- A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding
著作 2020
- Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor plattform
- Study of solder interconnect configurations & performance of vertical laser assited assembled “3.5D” packages
- A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs
Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages
著作 2019
- Controlled Gold Nanoparticle Placement into Patterned Polydimethylsiloxane Thin Films via Directed Self-Assembly
- Vertical laser assisted bonding for advanced “3.5D” chip packaging
- SB²-WB: A new process solution for advanced wire-bonding