PacTechの出版物

Forming of advanced THT-interconnects using SB² laser solder jetting process

Next generation advanced packaging using innovative laser assisted bonding equipment

Innovative laser assisted 3.5D and SB² WB assembly processes for next generation advanced packaging

Versatile hermetically sealed sensor platform for high frequency applications

Assembly and Repair of mini- and µ-LED display panels using innovative laser assisted bonding

Lasergestützte Fügeprozesse als Schlüsseltechnologie der zukünftigen Aufbau- und Verbindungstechnik

Laser-assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures

A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding

Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor plattform

Study of solder interconnect configurations & performance of vertical laser assited assembled “3.5D” packages

A study on laser-assisted bonding (LAB) and its influence on luminescence characteristics of blue and YAG phosphor encapsulated InGaN LEDs

Laser-assisted bonding (LAB) and de-bonding (LAdB) as an advanced process solution for selective repair of 3D and multi-die chip packages

Controlled Gold Nanoparticle Placement into Patterned Polydimethylsiloxane Thin Films via Directed Self-Assembly

Vertical laser assisted bonding for advanced “3.5D” chip packaging

SB²-WB: A new process solution for advanced wire-bonding