PACTECH メデイアライブラリー

  • Electroless Deposition with PacLine 300

  • Laser Assisted Bonding with LaPlace

  • High Speed Solder Ball Attach and Laser Reflow with SB²-Jet

  • Automated Solder Bumping Machine with Ultra-SB² 300

  • Camera Module Repair Process

  • Selective Solder Bumping De- & Reballing

  • Horizontal Heating Repair Process

  • Auto Rotation Function for Camera Modules with SB²-SM

  • Solder Ball Jetting Process with SB²

  • SB²-SMs Process

  • Vertical Flip Chip Bonding with LaPlace

  • Solder Stacking with SB²-Technology

  • Ball Grid Array (BGA) Rework with SB² Technology

  • Thomas Oppert stellt das Lasersystem SB²-Jet vor (german)

  • PacTech und eine erfolgreiche Messe (german)