Nauen, Germany — January 28, 2026 — PacTech – Packaging Technologies GmbH, a leading provider of laser-based bonding equipment and advanced wafer-level packaging services, today announced that it has joined the Glass Panel Technology Group, an international consortium led by Fraunhofer IZM focused on accelerating the development and industrialization of glass-based substrates for future semiconductor packaging.
By joining the consortium, PacTech reaffirms its commitment to advancing Laser-Assisted Reflow (LAR), a key enabling technology for fine-pitch, high-density, and thermo-sensitive packaging architectures on emerging panel substrates, including glass.
LAR: A Critical Enabler for Glass-Based and Next-Generation Interconnects
As device pitches shrink and substrate materials diversify, conventional reflow processes face increasing limitations due to high thermal exposure, warpage, mechanical stress and constraints on processing large substrates.
Laser-Assisted Reflow (LAR) technology, one of PacTech’s many proprietary laser-based bonding processes on its industry-leading LAPLACE ® assembly platforms, overcomes these challenges by applying highly controlled, precision opto-thermal energy exactly where it matters most: directly at the interconnect. This approach significantly reduces thermal stress, improves bond integrity on thermo-sensitive materials, and supports scalable processing on large-area panels.
„Glass is emerging as a highly attractive substrate for heterogeneous integration, with panels of 600 × 600 mm pushing the limits due to their brittleness and extreme warpage. Handling and processing these large sizes require existing technologies to be upgraded or entirely reimagined unlocking huge opportunities for innovation while LAR is perfectly suited to meet the material’s unique challenges,” said Matthias Fettke, Vice President of the Advanced Packaging Equipment Business Unit at PacTech. “Together with leading partners in the group, PacTech drives the development of industrially viable assembly solutions, qualifying its precise, low-stress bonding technologies as part of the supply chain for market readiness, thereby paving the way for next-generation system-in-package and advanced chiplet architectures.”
Participation in the Glass Panel Technology Group aligns with PacTech’s long-term roadmap to support advanced packaging innovations, chiplet architectures, and heterogeneous system-in-package (SiP) platforms.
About PacTech
PacTech is a global leader in manufacturing laser assisted bonding, laser assisted reflow and solder balling/jetting equipment as well as wet chemical plating lines. The company also offers plating chemistries and high-volume subcontractor bumping and die preparation services for semiconductors, catering to diverse applications in consumer electronics, automotive, aerospace, sensors, MEMS, RF, and AI technologies. With manufacturing facilities in Germany (HQ), the USA, and Malaysia, PacTech is well-positioned to support the evolving needs of the semiconductor industry worldwide.
Media Contact
Thomas Oppert
Vice President of Sales
PacTech – Packaging Technologies GmbH
Email: Oppert@pactech.de
Website: https://pactech.com/
