Vertical Flip Chip Bonding with LAPLACE ® https://pactech.com/wp-content/uploads/2023/03/Vertical-Flip-Chip-Bonding-by-PacTech.mp4 Vertical Flip Chip Bonding powered by PacTech’s unique LAPLACE ® technology. Pia Bubelt2025-08-27T09:08:49+02:00